M. Moharana and A. Mallik,"Nickel electrocrystallization in different electrolytes: An in-process and post synthesis analysis", Electrochimica Acta, vol.98, pp.1-10, Elsevier, May 2013, 10.1016/j.electacta.2013.03.031       Article

A. Mallik,"An analysis on the effect of temperature on electrocrystallization mechanism during deposition of Cu thin films", Transactions of the Indian Institute of Metals, vol.66, no.1, pp.79-85, February 2013, 10.1007/s12666-012-0229-3       Article

A. Mallik, A. S. Bankoti, and B. C. Ray,"On the effects of bath composition and ultrasound on structure and properties of Cu thin films", Russian Journal of Electrochemistry, vol.49, no.2, pp.131-137, Springer, February 2013, 10.1134/S1023193513020134       Article

A. Mallik and B. C. Ray,"Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: A kinetics and structural correlation", Materials Research, vol.16, no.2, pp.539-545, SciELO, April 2013, 10.1590/S1516-14392013005000009       Article

A. Das, A. Mallik, and B. C. Ray,"Analysis of effect of ultrasound on the magnetic topography of electroplated ni films by magnetic force microscopy (MFM)", Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, vol.43, no.2, pp.267-275, Springer, April 2012, 10.1007/s11663-011-9593-3       Article

A. Mallik and B. C. Ray,"Residual stress and nanomechanical properties of sonoelectrodeposited Cu films", Surface Engineering, vol.27, no.7, pp.551-556, Taylor & Francis, January 2011, 10.1179/1743294411Y.0000000011       Article

A. Mallik and B. C. Ray,"An analysis of the temperature-induced supersaturation effects on structure and properties of sono-electrodeposited copper thin films", Surface and Coatings Technology, vol.206, no.7, pp.1947-1954, Elsevier, December 2011, 10.1016/j.surfcoat.2011.09.066       Article

A. Mallik and B. C. Ray,"Residual stress and nanomechanical properties of sonoelectrodeposited Cu films", Surface Engineering, vol.27, no.7, pp.551-556, Taylor & Francis Group, January 2011, 10.1179/1743294411Y.0000000011       Article

A. Mallik and A. Das,"Effect of plating parameters on the magnetic structure distribution in electrodeposited Co/Cu alloy films by magnetic force microscope", Journal of Advanced Microscopy Research, vol.5, no.3, pp.200-208, American Scientific Publishers, December 2010, 10.1166/jamr.2010.1043       Article